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| RF2046 0 Typical Applications * Broadband, Low Noise Gain Blocks * IF or RF Buffer Amplifiers * Driver Stage for Power Amplifiers Product Description The RF2046 is a general purpose, low cost RF amplifier IC. The device is manufactured on an advanced Gallium Arsenide Heterojunction Bipolar Transistor (HBT) process, and has been designed for use as an easily-cascadable 50 gain block. Applications include IF and RF amplification in wireless voice and data communication products operating in frequency bands up to 3000MHz. The device is self-contained with 50 input and output impedances and requires only two external DC biasing elements to operate as specified. With a goal of enhanced reliability, the extremely small Micro-X ceramic package offers significantly lower thermal resistance than similar size plastic packages. 0.025 0.002 3 GENERAL PURPOSE AMPLIFIER * Final PA for Low Power Applications * High Reliability Applications * Broadband Test Equipment 0.052 0.041 0.070 sq. 45 1 0.068 0.002 0.005 0.002 0.200 Sq. Typ. 0.020 0.002 0.015 +0.002 -0.001 0.040 0.002 NOTES: 1. Shaded lead is pin 1. 2. Darkened areas are metallization. 3. Dimension applies to ceramic lid minus epoxy coating. Optimum Technology Matching(R) Applied Si BJT Si Bi-CMOS InGaP/HBT GaAs HBT SiGe HBT GaN HEMT GaAs MESFET Si CMOS SiGe Bi-CMOS Package Style: Micro-X Ceramic Features * DC to 3000MHz Operation * Internally matched Input and Output * 22dB Small Signal Gain GND 4 MARKING - C6 * 3.0dB Noise Figure * 10mW Linear Output Power * Single Positive Power Supply RF IN 1 3 RF OUT Ordering Information 2 GND RF2046 General Purpose Amplifier RF2046PCBA-41XFully Assembled Evaluation Board Functional Block Diagram RF Micro Devices, Inc. 7628 Thorndike Road Greensboro, NC 27409, USA Tel (336) 664 1233 Fax (336) 664 0454 http://www.rfmd.com Rev A11 050207 4-173 RF2046 Absolute Maximum Ratings Parameter Input RF Power Operating Ambient Temperature Storage Temperature Rating +13 -40 to +85 -60 to +150 Unit dBm C C Caution! ESD sensitive device. RF Micro Devices believes the furnished information is correct and accurate at the time of this printing. However, RF Micro Devices reserves the right to make changes to its products without notice. RF Micro Devices does not assume responsibility for the use of the described product(s). Parameter Overall Frequency Range Gain Min. Specification Typ. Max. DC to 3000 22.7 22.1 21.0 19.2 0.9 2.7 <2.0:1 <1.9:1 +23.5 +10.7 22.8 275 117 Unit MHz dB dB dB dB dB dB Condition T=25 C, VD =3.5V, ICC =35mA Freq=100MHz Freq=1000MHz Freq=2000MHz Freq=3000MHz 100MHz to 2000MHz Freq=2000MHz In a 50 system, DC to 3000MHz In a 50 system, DC to 3000MHz Freq=2000MHz100kHz, PTONE =-18dBm Freq=2000MHz Freq=2000MHz ICC =35mA, PDISS =116mW (See Note 1.) 18 Gain Flatness Noise Figure Input VSWR Output VSWR Output IP3 Output P1dB Reverse Isolation dBm dBm dB C/W C Thermal ThetaJC Maximum Measured Junction Temperature at DC Bias Conditions Mean Time To Failure (MTTF) 280,000 3.0 3.6 3.5 4.3 4.0 4.6 35 years V V mA Power Supply Device Operating Voltage Operating Current NOTES: Note 1: The RF2046 must be operated at or below 35mA in order to achieve the thermal performance stated above. Operating at 35mA will ensure the best possible combination of reliability and electrical performance. Note 2: Because of process variations from part to part, the current resulting from a fixed bias voltage will vary. As a result, caution should be used in designing fixed voltage bias circuits to ensure the worst case bias current does not exceed 35mA over all intended operating conditions. TAMB =+85C With 22 bias resistor, T=+25C At pin 3 with ICC =35mA At evaluation board connector, ICC =35mA See Note 2. 4-174 Rev A11 050207 RF2046 Pin 1 Function RF IN Description RF input pin. This pin is NOT internally DC-blocked. A DC-blocking capacitor, suitable for the frequency of operation, should be used in most applications. DC-coupling of the input is not allowed, because this will override the internal feedback loop and cause temperature instability. Ground connection. For best performance, keep traces physically short and connect immediately to ground plane. RF output and bias pin. Biasing is accomplished with an external series resistor and choke inductor to VCC. The resistor is selected to set the DC current into this pin to a desired level. The resistor value is determined by the following equation: Interface Schematic 2 3 GND RF OUT RF OUT ( V SUPPLY - V DEVICE ) R = -----------------------------------------------------I CC Care should also be taken in the resistor selection to ensure that the current into the part never exceeds 35mA over the planned operating temperature. This means that a resistor between the supply and this pin is always required, even if a supply near 3.5V is available, to provide DC feedback to prevent thermal runaway. Because DC is present on this pin, a DC-blocking capacitor, suitable for the frequency of operation, should be used in most applications. The supply side of the bias network should also be well bypassed. Same as pin 2. RF IN 4 GND Application Schematic VCC 10 n F 22 pF 4 47 nH 22 pF RF IN 1 3 RBIAS RF OUT 22 pF 2 Rev A11 050207 4-175 RF2046 Evaluation Board Schematic (Download Bill of Materials from www.rfmd.com.) P1 P1-1 1 2 NC 3 4 VCC GND Drawing 204X400R1 22 L1 100 nH 1 3 C2 100 pF C3 100 pF C4 1 F VCC P1-1 RF IN J1 50 strip C1 100 pF 50 strip RF OUT J2 2 Evaluation Board Layout Board Size 1.195" x 1.000" 4-176 Rev A11 050207 RF2046 Gain versus Frequency Across Temperature 24.0 23.0 22.0 21.0 20.0 19.0 18.0 17.0 16.0 15.0 14.0 0.0 1000.0 2000.0 3000.0 4000.0 5000.0 6000.0 10.0 0.0 1000.0 2000.0 3000.0 4000.0 5000.0 6000.0 11.0 -40C 25C 85C Output P1dB versus Frequency Across Temperature 15.0 -40C 25C 85C 14.0 ICC=35mA ICC=35mA Output Power (dBm) Frequency (MHz) Gain (dB) 13.0 12.0 Frequency (MHz) Output IP3 versus Frequency Across Temperature 27.0 Noise Figure versus Frequency Across Temperature 5.0 ICC=35mA ICC=35mA 3rd Order Intercept Power (dBm) 26.0 4.0 25.0 Noise Figure (dB) -40C 25C 85C 3.0 24.0 2.0 23.0 -40C 25C 85C 1.0 0.0 1000.0 2000.0 3000.0 4000.0 5000.0 6000.0 0.0 1000.0 2000.0 3000.0 4000.0 5000.0 6000.0 22.0 Frequency (MHz) Frequency (MHz) Input VSWR versus Frequency Across Temperature 2.50 Output VSWR versus Frequency Across Temperature 2.50 ICC=35mA -40C 25C 85C ICC=35mA 2.25 2.25 2.00 2.00 VSWR 1.75 VSWR 1.75 1.50 1.50 1.25 1.25 -40C 25C 85C 1.00 0.00 1000.00 2000.00 3000.00 4000.00 5000.00 6000.00 1.00 0.00 1000.00 2000.00 3000.00 4000.00 5000.00 6000.00 Frequency (MHz) Frequency (MHz) Rev A11 050207 4-177 RF2046 Reverse Isolation versus Frequency Across Temperature ICC=35mA 26.0 50.0 Typical Current versus Voltage (At Evaluation Board Connect, RBIAS=22 Ohms) 25.0 24.0 40.0 Reverse Isolation (dB) 23.0 22.0 ICC (mA) 30.0 21.0 20.0 -40C 25C 85C 20.0 -40C 25C 85C 10.0 0.0 1000.0 2000.0 3000.0 4000.0 5000.0 6000.0 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 19.0 18.0 Frequency (MHz) VCC (V) Typical ICC versus VPIN 50.0 Power Dissipated versus Voltage at Pin 3 0.20 (At Pin 3) (TAMBIENT=85C) 40.0 0.15 30.0 Power Dissipated (W) -40C 25C 85C Vcc=4.2 V 3.2 3.3 3.4 3.5 3.6 3.7 3.8 ICC (mA) 0.10 20.0 0.05 10.0 0.00 2.60 2.70 2.80 2.90 3.00 3.10 3.20 3.30 3.40 3.50 VPIN (V) VPIN (V) TMAX versus PDISS 140.00 135.00 MTTF versus Junction Temperature (Valid for ICC<35mA) 10000000.0 (TAMBIENT=85C) RFMD HBT2um AlGaAs-2 (60% Confidence Interval) 1000000.0 130.00 125.00 120.00 115.00 110.00 105.00 100000.0 MTTF (Years) TMAX (C) 10000.0 1000.0 100.0 100.00 95.00 0.00 0.05 0.10 0.15 0.20 0.25 10.0 100.0 125.0 150.0 175.0 200.0 PDISS (W) Junction Temperature (C) 4-178 Rev A11 050207 RF2046 PCB Design Requirements PCB Surface Finish The PCB surface finish used for RFMD's qualification process is Electroless Nickel, immersion Gold. Typical thickness is 3inch to 8inch Gold over 180inch Nickel. PCB Land Pattern Recommendation PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances. PCB Metal Land Mask Pattern A = 1.90 x 1.14 Typ. B = 0.63 x 1.90 Typ. Dimensions in mm. A Pin 1 3.68 Typ. 1.84 Typ. B B A 1.84 Typ. 3.68 Typ. Figure 1. PCB Metal Land Pattern - RF204X (Top View) PCB Solder Mask Pattern Rev A11 050207 4-179 RF2046 Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier. A = 2.06 x 1.30 Typ. B = 0.79 x 2.06 Typ. Dimensions in mm. A Pin 1 3.68 Typ. 1.84 Typ. B B A 1.84 Typ. 3.68 Typ. Figure 2. PCB Solder Mask - RF204X (Top View) 4-180 Rev A11 050207 |
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